主要用於各種非金屬材料的切槽和切斷加工，具體包括：
‧半導體材料
    Si,Ge,GaP,GaAs,GaAsP,LinbO3,BiSb,BGA,QFN,PQFN,etc.
‧陶瓷材料
    Al2,O3,ZrO2,Si3N4,BaTiO3,CaTiO3 and so on.
‧磁性材料
    鐵氧體及各種磁類材料
‧其他材料
    水晶、玻璃、石英、硬質合金、印刷電路板等

Mainly used for grooving and cutting various metalloid materials,including:
‧Semiconductor materials:
    Si,Ge,GaP,GaAs,GaAsP,LinbO3,BiSb,BGA,QFN,PQFN,etc. 
‧Oxide ceramic materials:
    Al2,O3,ZrO2,Si3N4,BaTiO3,CaTiO3 and so on. 
‧Magnetic materials:
    Ferrite and various magnetic head. 
‧Othrs: 
    Glass,quartz,carbide,printing circuit board and so on.