‧砂輪壽命長
‧不會造成精圓表面刮傷
‧降低砂輪修整次數
‧降低研磨阻力
‧當地化生產、成本低

Application:Silicon and compound semiconductor wafer, etc
Features:Longer wheel life Extremly low depth of sub-surface Reduced wheel dressing Reduced grinding resistance Locatization,cost down